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Red Cedar Technology and ETA Revolutionize Die System Design, Simulation, and Optimization

Dynaform-OP
East Lansing, MI (October 16, 2012) – Designing die systems that yield great looking designs with minimal waste, optimal performance, and an absence of wrinkling and cracking is a daunting task. ETA’s new DynaForm OP™, part of the Inventium Suite™ of products, provides the perfect solution. DynaForm OP™ combines the power and speed of Red Cedar Technology's SHERPA™ optimization engine with the simulation and analysis strengths of the DynaForm product to deliver a solution that makes it simple to optimize complex die designs. Initially, DynaForm OP™ will be focused on supporting drawbead optimization to determine proper binder force, lubrication, gage, and material. The module will also support 2D optimization of blank shape and size. Eventually, the two companies expect to offer fully automatic die face optimization.

The new OP module features an internal incremental solver that delivers exceptional speed using symmetric multiprocessing (SMP) on dual core and quad core PCs running Windows 7.

Under the new agreement, ETA will embed SHERPA™ into the DynaForm OP product in an OEM licensing arrangement.
 

► Read the press release

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